Thermocompression bonding in integrated circuit packaging

Details Thermocompression bonding in integrated circuit packaging Thermocompression bonding in integrated circuit packaging

1989-08-25

1991-04-09

Hille, Rolf

357 67, 357 69, H01L 2348, H01L 2354

Patent

active

050069179

ABSTRACT:
A contact member for thermocompression bonding in integrated circuit packaging has on a conductor end a uniform texture deformable layer with a hardness value in the range of that of soft gold which is approximately 90 on the Knoop scale and with a rough surface morphology having ridges with approximately 1 micrometer modulation frequency and a depth between ridges of from 1/4 to 1/2 that of the average integrated circuit pad. The deformable layer is produced by plating gold in a strong electronegative plating bath within a range of 0.03 to 0.05 mA/sq.cm. current density. Plating apparatus, for plating different areas, with different electronegative conditions, with separate independently powered anodes, is provided.

REFERENCES:
patent: 3873428 (1975-03-01), Winters
patent: 4096983 (1978-06-01), Beilein et al.
patent: 4188438 (1980-02-01), Burns
patent: 4263606 (1981-04-01), Yorkane
patent: 4572924 (1986-02-01), Wakely et al.
patent: 4862322 (1989-08-01), Bickford et al.
Microelectronics Packaging Handbook edited by Rao R. Tummala and Eugene J. Rymaszewski, Van Nostrand (1989), pp. 409-431.
Br. Telecom. Technol. J. Vol. 3, No. 3, July 1985, pp. 86-92, "Tape Automated Bonding", by Small et al.
IBM Technical Disclosure Bulletin, vol. 30, No. 7, Dec., 1987, pp. 208-209, "High Strength Thermocompression Bonds", by Bickford et al.
Plating Magazine, July 1973, pp. 715-719, "The Strength and Ductility of Some Gold Electrodeposits", by Deuber et al.
Metal Finishing Guidebook, vol. 83, No. 1A, "Gold Plating", by A. M. Weisberg, Metals & Plastics Pub. Inc. Hackensack, N.J. 1985, pp. 232-234.

Affiliated with

Also associated with

Rating

Thermocompression bonding in integrated circuit packaging does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermocompression bonding in integrated circuit packaging, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermocompression bonding in integrated circuit packaging will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2038678