Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2006-03-07
2006-03-07
Schilling, Richard L. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S302000, C430S330000, C430S910000, C430S964000
Reexamination Certificate
active
07008751
ABSTRACT:
Imageable elements useful as lithographic printing plate precursors are disclosed. The element comprises an imageable layer over a support. The imageable layer contains a photothermal conversion material and a polymeric binder that comprises a polymer backbone with sulfobetaine- and/or carboxybetaine-containing side chains. The imageable elements do not require processing in a developer. They can be thermally imaged and immediately treated with fountain solution and ink without a development step.
REFERENCES:
patent: 5478690 (1995-12-01), Kanda et al.
patent: 5512418 (1996-04-01), Ma
patent: 5922512 (1999-07-01), DoMinh
patent: 6165691 (2000-12-01), Damme et al.
patent: 6190830 (2001-02-01), Leon et al.
patent: 6410202 (2002-06-01), Fleming et al.
patent: 6423469 (2002-07-01), DoMinh et al.
patent: 6447978 (2002-09-01), Leon et al.
patent: 6579622 (2003-06-01), West
patent: 2002/0123001 (2002-09-01), Dorr et el.
patent: H10-097065 (1998-04-01), None
Beckley Scott
Tao Ting
Eastman Kodak Company
Ratner & Prestia
Schilling Richard L.
LandOfFree
Thermally switchable imageable elements containing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermally switchable imageable elements containing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally switchable imageable elements containing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3609653