Thermally enhanced metal capped BGA package

Details Thermally enhanced metal capped BGA package Thermally enhanced metal capped BGA package

2008-01-15

2008-01-15

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE23092

Reexamination Certificate

active

11075102

ABSTRACT:
A thermally enhanced wirebond BGA package having a laminate substrate, an IC device mounted on the substrate, and a metal cap defining a cavity inside the package between the IC device and the metal cap. A substantial portion of the cavity is filled with a thermally enhanced epoxy encapsulant establishing a thermal conduction path between the IC device and the metal cap. The BGA package may be further enhanced by bonding a metal heat slug on the laminate substrate and mounting the IC device on the slug.

REFERENCES:
patent: 6081997 (2000-07-01), Chia et al.
patent: 6379997 (2002-04-01), Kawahara et al.
patent: 6552263 (2003-04-01), Farquhar et al.
patent: 6821819 (2004-11-01), Benavides et al.
patent: 2004/0043539 (2004-03-01), Lee et al.
patent: 2005/0186704 (2005-08-01), Yee et al.

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