1991-07-18
1992-09-08
Hille, Rolf
357 81, H01L 2334, H01L 2336, H01L 2312
Patent
active
051463105
ABSTRACT:
A thermally enhanced leadframe having heat conductive paths which thermally couple a die attach pad to thermal connection points spread out as far as possible from each other on the perimeter of the package. The area of the heat conductive path is maximized to occupy substantially all area in the package not occupied by the electrically conductive paths between the wire bond locations and the external connection points such as pins. This configuration maximizes the area of the printed circuit board which is heated thereby increasing thermal cooling efficiency. Further, the leadframe configuration maximizes the area of contact between the integrated circuit package and the heat conductive path thereby increasing the thermal conductivity between the device junctions on the integrated circuit die and the ambient through the material of the package itself.
REFERENCES:
patent: 4809053 (1989-02-01), Kuriashi
Bayan Jaime A.
Demmin Jeffrey C.
DiOrio Mark L.
Kwon Young I.
Clark S. V.
Hille Rolf
National Semiconductor Corp.
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