Thermally conductive chuck for vacuum processor

Details Thermally conductive chuck for vacuum processor Thermally conductive chuck for vacuum processor

2005-06-21

2005-06-21

Ford, John K. (Department: 3753)

Heat exchange

With timer, programmer, time delay, or condition responsive...

Control of amount of conductive gas in confined space...

C165S080100, C165S080400, C165S080500, C156S345270, C156S345520, C156S345530, C118S724000, C118S725000, C204S298090

Reexamination Certificate

active

06907924

ABSTRACT:
A chuck body mounts a substrate within a vacuum chamber. Contiguous portions of the substrate and the chuck body form a heat-transfer interface. An intermediate sealing structure seals the chuck body to the substrate independently of any contact between the chuck body and the substrate and forms a separately pressurizable region within the vacuum chamber. A control system promotes flows of fluid through a periphery of the heat-transfer interface within the separately pressurizable region for controlling fluid pressures and related transfers of heat at the heat-transfer interface according to an overall aim of regulating the substrate temperature.

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