Thermally conductive bar cooling arrangement for a transistor

Details Thermally conductive bar cooling arrangement for a transistor Thermally conductive bar cooling arrangement for a transistor

1990-01-31

1993-05-25

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257713, 257718, 257719, 333246, 333247, 361380, 361381, 361386, 361389, H01L 2302, H02B 100, H05K 720, H01P 308

Patent

active

052143090

ABSTRACT:
A cooling structure for a high frequency power transistor is mounted on a circuit board where heat generated by the transistor is conducted from the semiconductor material through the collector conductor. A metal piece, which is larger than the collector conductor and sized to the requirements of heat removal through the collector conductor, contacts the collector conductor or an extension. The metal piece is solidly attached to a conductor strip formed on the circuit board. Heat is dissipated from the exposed surface of the metal piece to the ambient air and by conduction to the circuit board.

REFERENCES:
patent: 3192307 (1965-06-01), Lazar
patent: 3479570 (1969-11-01), Gilbert
patent: 3517272 (1970-06-01), Lee et al.
patent: 3962719 (1976-06-01), Pfaff
patent: 3982271 (1976-09-01), Olivieri et al.
patent: 4030001 (1977-06-01), Medley, Jr. et al.
patent: 4720742 (1988-01-01), Egawa et al.
patent: 4950427 (1990-08-01), Endo
patent: 5012322 (1991-04-01), Guillotte et al.
European Search Report, Application No. EP 90 10 2984.

Affiliated with

Also associated with

Rating

Thermally conductive bar cooling arrangement for a transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally conductive bar cooling arrangement for a transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally conductive bar cooling arrangement for a transistor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-899622