Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2008-06-16
2010-10-26
Whitmore, Stacy A (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000
Reexamination Certificate
active
07823102
ABSTRACT:
In a first variation, a thermally aware design automation suite integrates system-level thermal awareness into design of semiconductor chips, performing fine-grain thermal simulations of the chips based on thermal models and boundary conditions. The suite uses results of the simulations to modify thermally significant structures to achieve desired thermal variations across a chip, meet design assertions on selected portions of the chip, and verify overall performance and reliability of the chip over designated operating ranges and manufacturing variations. In a second variation, a discretization approach models chip temperature distributions using heuristics to adaptively grid space in three dimensions. Adaptive and locally variable grid spacing techniques are used to efficiently and accurately converge for steady state and/or transient temperature solutions. The modeling optionally reads a mesh initialization file specifying selected aspects and parameters associated with controlling use and behavior of the variable grid spacing techniques.
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Chandra Rajit
Gopal Nanda
Srinivasan Adi
Dyke Korbin Van
Gradient Design Automation Inc.
PatentVentures
Smith Bennett
Whitmore Stacy A
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