Thermal treatment of silicon integrated circuit chips to prevent

Details Thermal treatment of silicon integrated circuit chips to prevent Thermal treatment of silicon integrated circuit chips to prevent

1989-05-26

1991-05-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437187, 437197, 437247, 437248, 357 82, H01L 21324

Patent

active

050195336

ABSTRACT:
Voids in aluminum metallization conductors on a chip are avoided or healed after the chip is subjected to thermal treatment at a high temperature sufficient to allow diffusion of silicon by rapidly cooling the chip, preferably by immersion of the chip in liquid nitrogen.

REFERENCES:
patent: 3987216 (1976-10-01), Bhatia et al.
patent: 4525221 (1985-06-01), Wu

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