Thermal transfer overcoat tag reduction

Details Thermal transfer overcoat tag reduction Thermal transfer overcoat tag reduction

2005-06-07

2005-06-07

Colilla, Daniel J. (Department: 2854)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S345420

Reexamination Certificate

active

06902643

ABSTRACT:
A thermal transfer overcoating technology for reducing overcoat tags. Skewing the interface between a carrier ribbon to coated document at the peeling of the carrier from the coated document concentrates the forces at the interface to a smaller region of the document edge. Moreover, tensioning the document at the interface changes the forces at the interface from peeling type to tensile type.

REFERENCES:
patent: 3684628 (1972-08-01), Clarke et al.
patent: 4346855 (1982-08-01), Biggar, III
patent: 4738555 (1988-04-01), Nagashima
patent: 4815872 (1989-03-01), Nagashima
patent: 5520763 (1996-05-01), Johnstone
patent: 5555011 (1996-09-01), Tang et al.
patent: 5578824 (1996-11-01), Koguchi et al.
patent: 6171429 (2001-01-01), Aindow et al.
patent: 6223799 (2001-05-01), Johnstone
patent: 6554044 (2003-04-01), Paulson et al.
patent: 6684925 (2004-02-01), Nagate et al.
patent: 2002/0027586 (2002-03-01), Kikuchi et al.
patent: 2002/0108709 (2002-08-01), Fukada
patent: 2003/0121612 (2003-07-01), McKay et al.
patent: 08026235 (1996-01-01), None
patent: 10324319 (1998-12-01), None
James Knieser, “Skewed Blade Stripper,” Nov./Dec. 1977, Xerox Disclosure Journal, , vol. 2, No. 6, pp. 85-86.

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