Thermal stress-failure-resistant dielectric windows in...

Details Thermal stress-failure-resistant dielectric windows in... Thermal stress-failure-resistant dielectric windows in...

2011-06-14

2011-06-14

Nguyen, Nam X (Department: 1724)

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C204S298110, C204S298180

Reexamination Certificate

active

07959775

ABSTRACT:
A ceramic window in an iPVD module is provided with features that reduce heating of the window as a result of metal film deposits on the window. Dielectric dissipation and resistive heating of the metal film are reduced by the features. Reducing of the window heating is provided by either shaping the window surface on the chamber side of the window or providing structurally floating features to block at least a portion of a conductive path from forming on the chamber side window surface. The shaping can produce contours that prevent current paths from being created in the forming metal film. In addition or in the alternative, texture on the chamber side surface of the window is provided to increase surface area and thereby reduce film thickness.

REFERENCES:
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patent: 6623595 (2003-09-01), Han et al.
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patent: 2005/0011453 (2005-01-01), Okumura et al.
patent: 2006/0137821 (2006-06-01), Howald et al.

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