Thermal-resistant resin composition for printed circuit boards b

Details Thermal-resistant resin composition for printed circuit boards b Thermal-resistant resin composition for printed circuit boards b

1991-04-08

1992-05-12

Bleutge, John C.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525527, 528 96, 528102, 528118, C08G 5932

Patent

active

051129264

ABSTRACT:
This invention provides a epoxy resin composition for structual substrate of PCB comprising a triazine-modified bisphenol A epoxy resin reacted with a multi-functional epoxy resin, a brominated epoxy resin, a curing agent and a curing promoter to form a cured product with excellent thermal resistance (Tg is about 170.degree.-220.degree. C. and mostly higher than 180.degree. C.) as well as good drilling properties and good toughness.
Besides, it has comparable electrical and physical properties as the commercially available FR-4 printed circuit boards.

REFERENCES:
patent: 2893978 (1959-07-01), Cooke
patent: 2947726 (1960-08-01), Belanger
patent: 4665149 (1987-05-01), Bertram et al.
Translation of Japan 63-305,122, already of record untranslated.
Translation of Japan 63-301,221, already of record untranslated.

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