Thermal micropump with values formed from silicon plates

Details Thermal micropump with values formed from silicon plates Thermal micropump with values formed from silicon plates

1993-06-16

1994-12-27

Bertsch, Richard A.

Pumps

Expansion and contraction of pump fluid

417207, F04B 1924

Patent

active

053759796

ABSTRACT:
In a micropump having a working chamber (1), an intake valve (2), and a discharge valve (3), the valves (2,3) are etched out of silicon wafers (4,5). The gas in the working chamber (1) is heated by a heating element (6), so that an overpressure is produced in the working chamber. A partial vacuum is created by cooling the gas in the working chamber (1). The pump action of the micropump is achieved through the succession of overpressure and partial-vacuum cycles.

REFERENCES:
patent: 4805804 (1989-02-01), Raczkowski
patent: 4849774 (1989-07-01), Endo et al.

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