Thermal management of power conditioning systems

Details Thermal management of power conditioning systems Thermal management of power conditioning systems

1990-05-01

1992-05-05

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 357 81, 361385, 165 804, H01L 2504, H01L 3902, H01L 2302

Patent

active

051112809

ABSTRACT:
A semi-conductor assembly including an elongated electrically conductive support structure defining a sinuous coolant flow path between respective upper and lower surfaces of the support structure. The sinuous coolant path includes alternating concave and convex coolant surfaces. A first series of semi-conductor devices is secured in a thermally intimate manner to the upper surface of the support structure, and a second series of semi-conductor devices is secured in a thermally intimate manner to the lower surface of the support structure. Each semi-conductor device is disposed proximate a concave curved surface of the coolant path.

REFERENCES:
patent: 4712609 (1987-12-01), Iversen
patent: 4774630 (1988-09-01), Reisman et al.
patent: 4799543 (1989-01-01), Iversen et al.

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