Thermal joint

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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174 163, H05K 720

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052913716

ABSTRACT:
A thermal joint for transferring heat from a first object to a second object contains a first relatively thick layer of high bulk thermal conductivity material and a second relatively thin layer of lubricant. In a preferred embodiment an anti-adhesion coating is also present in the joint. The thermal joint completely fills the gap between the first and second objects while enabling relative sliding motion to compensate for any lateral distortion.

REFERENCES:
patent: 3405323 (1968-10-01), Surty et al.
patent: 3626252 (1971-12-01), Cath
patent: 4069497 (1978-01-01), Steidlitz
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4092697 (1978-05-01), Spaight
patent: 4109707 (1978-08-01), Wilson et al.
patent: 4151547 (1979-04-01), Rhodes et al.
patent: 4226281 (1980-10-01), Chu
patent: 4233645 (1980-11-01), Balderes et al.
patent: 4254431 (1981-03-01), Babuka et al.
patent: 4258411 (1981-03-01), Sherman
patent: 4323914 (1982-04-01), Berndlmaier et al.
patent: 4341432 (1982-07-01), Cutchaw
patent: 4381032 (1983-04-01), Cutchaw
patent: 4384610 (1983-05-01), Cook et al.
patent: 4462462 (1984-07-01), Meagher et al.
patent: 4494171 (1985-01-01), Bland et al.
patent: 4531146 (1985-07-01), Cutchaw
patent: 4546409 (1985-10-01), Yoshino et al.
patent: 4551787 (1985-11-01), Mittal et al.
patent: 4558395 (1985-12-01), Yamada et al.
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4567505 (1986-01-01), Pease et al.
patent: 4602314 (1986-07-01), Broadbent
patent: 4607277 (1986-08-01), Hassan et al.
patent: 4612601 (1986-04-01), Watari et al.
patent: 4639829 (1987-01-01), Ostergren
patent: 4730665 (1988-03-01), Cutchaw
patent: 4730666 (1988-03-01), Flint et al.
patent: 4758926 (1988-07-01), Herrell et al.
patent: 4879632 (1989-11-01), Yamamoto et al.
patent: 4915167 (1990-04-01), Altoz
D. B. Tuckerman et al, "High-Performance Heat Sinking for VLSI", IEEE Electron Dev. Lett., vol. EDL-2, No. 5, May 1981, pp. 126-129.
Blodgett et al, "Thermal Conduction Module: A High-Performance Multilayer Ceramic Package", IBM J. Res. Develop., vol. 26, No. 1, Jan., 1982, pp. 30-36.
H. Martin, "Heat and Mass Transfer Between Impinging Gas Jets and Solid Surfaces", Advance Heat Transfer, vol. 13 (1977).
R. C. Chu, IBM TDB "Design for Providing Thermal Interface Material Between Narrow Thermal Interface Gaps", vol. 20, No. 7, Dec. 1977, pp. 2761-2762.
R. C. Chu et al, IBM TDB "Force-Free Solid Thermal Conduction Module", vol. 23, No. 3, Aug. 1980, pp. 1123-1124.
J. R. Lynch, IBM TDB, "Air and Liquid Drop Cooled Module", vol. 22, No. 1, Jun. 1979, p. 97.
R. C. Miller, IBM TDB, "Structure for Achieving Thermal Enhancement in a Semiconductor Package", vol. 23, No. 6, Nov. 1980, p. 2308.
J. C. Horvath, IBM TDB, "Cooling Assembly for Solder-Bonded Semiconductor Devices", vol. 27, No. 7A, Dec. 1984, p. 3915.

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