Heat exchange – Flexible envelope or cover type
Reexamination Certificate
1999-03-30
2001-06-05
Lazarus, Ira S. (Department: 3743)
Heat exchange
Flexible envelope or cover type
C165S185000, C361S690000
Reexamination Certificate
active
06241005
ABSTRACT:
FIELD OF THE INVENTION
This invention generally relates to a thermal interface member. More particularly, the invention relates to a thermal interface member used in processing wafers under high temperature and vacuum conditions.
BACKGROUND OF THE INVENTION
Many substrate treatment processes involve exposing a substrate in a vacuum chamber to an ion beam, thereby causing the substrate to absorb heat. Because the substrate can only absorb a certain amount of heat or reach a certain temperature before being damaged, a common problem encountered is how to cool the wafer during treatment. Typical treatment processes require that substrate temperatures be maintained below 100° C. to be compatible with photoresist.
U.S. Pat. No. 4,949,783, which is assigned to the assignee of the present invention and is incorporated in its entirety herein by reference, is directed to a method and apparatus that employs backside gas to cool a wafer. While the patented technique is quite effective, the apparatus typically employs polymeric seals that have potential for degrading at high temperatures, e.g. greater than about 150° C.
Aside from heat generated as a by product of ion beam processing, it is sometimes desirable actually to supply additional heat to a wafer being processed as well as to cool such heated wafer. Such thermal controlled processing in high vacuum and at high temperatures, e.g. greater than about 150° C., also can cause degradation of polymeric materials such as seals, especially when processing is done for long periods of time.
SUMMARY OF THE INVENTION
The subject invention is directed to a compressible temperature transfer interface member having first and second spaced apart panel members which are sealed to each other to define a closed interior. A fluid such as a gas or liquid is disposed in the interior of the membrane. The panel members are formed from a flexible, thermally conductive material. Preferably, the interface includes a peripheral spacer that limits the compressibility of the membrane.
In typical use, the interface member is disposed on a temperature control seat, which is either a source of heat or of cooling. The wafer to be processed is clamped against the interface member so as to compress the interface member against the temperature control seat. Such interface compression creates internal pressure within the interface member which forces the flexible panel surfaces of the interface member to comply with their respective contact surfaces creating a dense array of contact points and increasing surface to surface contact between the interface member and the wafer on the one hand and the interface member and temperature control seat on the other hand to provide a uniform and high speed temperature transfer. Because of the improved contact, heat transfer is primarily through conduction and convection rather than radiation which is slower and more difficult to control.
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Duong Tho
Lazarus Ira S.
Morgan & Finnegan , LLP
Veeco Instruments Inc.
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