Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...
Reexamination Certificate
2007-06-12
2007-06-12
Edwards, N. (Department: 1774)
Stock material or miscellaneous articles
Web or sheet containing structurally defined element or...
Noninterengaged fiber-containing paper-free web or sheet...
C428S297400, C428S903000, C428S347000
Reexamination Certificate
active
10449156
ABSTRACT:
In one aspect, the invention provides a method of making a thermal interface material comprising the steps of: (a) providing a polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000; (b) melt-blending the polymer with at least 25 weight percent of a thermally conductive filler to form a mixture; and (c) forming the mixture of hot melt pressure sensitive adhesive and thermally conductive filler as a film. In another aspect, the invention may further comprise the steps of: providing a fire retardant and/or microfiber forming material; and/or irradiating the film with gamma or electron beam (E-beam) radiation or a combination of both to form a thermal interface material.
REFERENCES:
patent: RE24906 (1960-12-01), Ulrich
patent: 3725115 (1973-04-01), Christenson et al.
patent: 4059714 (1977-11-01), Scholl et al.
patent: 4234662 (1980-11-01), Pastor et al.
patent: 4310509 (1982-01-01), Berglund et al.
patent: 4323557 (1982-04-01), Rosso et al.
patent: 4361663 (1982-11-01), Agarwal et al.
patent: 4472480 (1984-09-01), Olson
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4851278 (1989-07-01), Enanoza
patent: 5026742 (1991-06-01), Rehmer
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5100728 (1992-03-01), Plamthottam et al.
patent: 5187235 (1993-02-01), Bordoloi et al.
patent: 5194455 (1993-03-01), Massow et al.
patent: 5232970 (1993-08-01), Solc et al.
patent: 5399416 (1995-03-01), Bujard
patent: 5416127 (1995-05-01), Chandran et al.
patent: 5429856 (1995-07-01), Krueger et al.
patent: 5550175 (1996-08-01), Bredahl et al.
patent: 5738936 (1998-04-01), Hanrahan
patent: 5753362 (1998-05-01), Kawase et al.
patent: 5804610 (1998-09-01), Hamer et al.
patent: 5890915 (1999-04-01), Reylek
patent: 5904796 (1999-05-01), Freuler et al.
patent: 5932298 (1999-08-01), Moon
patent: 6054198 (2000-04-01), Bunyan et al.
patent: 6103152 (2000-08-01), Gehlsen et al.
patent: 6197397 (2001-03-01), Sher et al.
patent: 6207272 (2001-03-01), Takahira et al.
patent: 6277488 (2001-08-01), Kobe et al.
patent: 6432497 (2002-08-01), Bunyan
patent: 6866928 (2005-03-01), Narum et al.
patent: 2001/0055878 (2001-12-01), Murata et al.
patent: 2002/0128336 (2002-09-01), Kolb et al.
patent: 2002/0155243 (2002-10-01), Kobe et al.
patent: 2002/0187294 (2002-12-01), Zhou et al.
patent: 198 51 166 (2000-05-01), None
patent: 0 566 093 (1993-10-01), None
patent: 0 878 527 (1998-11-01), None
patent: 2003-49144 (2003-02-01), None
patent: WO 95/25774 (1995-09-01), None
patent: WO 99/05722 (1999-02-01), None
patent: WO 01/57152 (2001-08-01), None
patent: WO 01/76855 (2001-10-01), None
patent: WO 02/20687 (2002-03-01), None
patent: WO 03/066766 (2003-08-01), None
patent: WO 04/056932 (2004-07-01), None
patent: WO 2004/061036 (2004-07-01), None
“Viscoelastic Properties of Pressure Sensitive Adhesives”, Handbook of Pressure Sensitive Adhesive Technology, Second Edition, Edited by Donatas Satas, 1989, pp. 172, 173, 174, 175, 202, 203.
Introduction to Physical Polymer Science, Chapter 1, p. 6, L. H. Sperling ISBN 0-471-89092-8, 1986.
Fischer Patrick J.
Kobe James J.
Murray Cameron T.
3M Innovative Properties Company
Bardell Scott A.
Edwards N.
LandOfFree
Thermal interface materials and method of making thermal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thermal interface materials and method of making thermal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal interface materials and method of making thermal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3854093