Thermal interface materials

Details Thermal interface materials Thermal interface materials

2011-01-11

2011-01-11

Eashoo, Mark (Department: 1796)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

C524S404000, C524S424000, C524S439000, C524S441000, C524S285000, C428S337000, C428S325000, C428S328000, C106S270000, C106S272000, C106S284400, C106S287170, C106S286100, C252S071000, C252S502000, C252S511000, C252S514000, C252S516000

Reexamination Certificate

active

07867609

ABSTRACT:
A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture. The contemplated thermal interface material can be provided as a dispensable liquid paste, a gel, a tape, or a film. Applications of the contemplated thermal interface materials described herein comprise incorporating the materials into a layered material, an electronic component or a finished electronic product.

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