Thermal interface material for combined reflow

Details Thermal interface material for combined reflow Thermal interface material for combined reflow

2008-03-31

2009-12-08

Mandala, Victor A (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S238000, C438S614000, C257S071000, C257SE21077, C257SE21083, C257S707000, C361S704000, C361S719000, C029S840000

Reexamination Certificate

active

07629203

ABSTRACT:
A combined thermal interface material and second layer interconnect reflow material and method are disclosed.

REFERENCES:
patent: 7164585 (2007-01-01), Jadhav et al.
patent: 2005/0145846 (2005-07-01), Brandenburger
patent: 2006/0227510 (2006-10-01), Fitzgerald et al.
patent: 2006/0275952 (2006-12-01), Gowda et al.
patent: 2006/0293172 (2006-12-01), Rubinsztajn et al.

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