Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2007-03-06
2010-02-16
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S779000, C257S705000, C257S706000, C257S720000, C257SE23023, C257SE23026
Reexamination Certificate
active
07663242
ABSTRACT:
A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.
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Hozer Leszek
Ingham Anthony E.
Kyaw David V.
Laughlin John P.
Lewis Brian G.
Clark Jasmine J
Senninger Powers LLP
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