Thermal interface material and electronic assembly having...

Details Thermal interface material and electronic assembly having... Thermal interface material and electronic assembly having...

2007-12-25

2007-12-25

Ahmed, Sheeba (Department: 1773)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

C428S325000, C428S328000, C428S329000, C428S330000, C428S413000, C428S418000, C428S446000, C428S447000, C428S450000, C428S461000, C428S580000, C428S913000

Reexamination Certificate

active

10038334

ABSTRACT:
A thermal interface material is described for thermal coupling of an electronic component to a thermally conductive member. The thermal interface material includes a viscoelastic polymer matrix material, fusible solder particles in the matrix material, and filler particles in the matrix material. The solder particles have a melting temperature below a selected temperature (e.g. 157° C. for indium) and the filler particles have a melting temperature substantially above the selected temperature (e.g. 961° C. for silver). The filler particles keep the thermal interface material intact under adverse thermal and stress conditions.

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patent: 0 790 762 (1997-08-01), None
patent: 1 143 511 (2001-10-01), None
patent: 1 143 512 (2001-10-01), None
PCT International Search Report, Feb. 11, 2003, 4 pages.

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