Thermal ink jet printhead with pre-diced nozzle face and method

Details Thermal ink jet printhead with pre-diced nozzle face and method Thermal ink jet printhead with pre-diced nozzle face and method

1990-09-04

1991-11-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156257, 156645, 156657, 156662, 156668, 346140R, H01L 21306, B44C 122, B29C 3700

Patent

active

050680064

ABSTRACT:
A plurality of thermal ink jet printheads, each with nozzles in a pre-diced nozzle face, obtained from sectioning of an etched channel wafer aligned and mated with a heating element containing wafer that have a patterned thick film layer sandwiched therebetween. The printhead nozzles and pre-diced nozzle face are produced in the channel wafer prior to the alignment and mating of the wafers by the combination of dicing a notch in the channel wafer through one end of a plurality of sets of etched channel grooves, forming the nozzles and the nozzle face in the channel wafer and photodelineating the thick film layer on the heating element wafer, so that when the wfaers are mated, the delineated edge of the thick film layer becomes part of the nozzles without requiring the cutting of the thick film layer by a dicing blade. In one embodiment, the heating element wafer has a similar notch diced therein adjacent the delineated edge of the thick film layer prior to mating with the channel wafer. The two notches are confrontingly aligned and the mated wafers are selected into separate printheads by dicing through the aligned notches, so that the dicing blade is spaded from the printhead nozzle faces.

REFERENCES:
patent: Re32572 (1988-01-01), Hawkins et al.
patent: 4638337 (1987-01-01), Torpey et al.
patent: 4774530 (1988-09-01), Hawkins
patent: 4878992 (1989-11-01), Campanelli

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