Thermal ink jet printhead and process therefor

Details Thermal ink jet printhead and process therefor Thermal ink jet printhead and process therefor

1985-04-03

1986-07-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156633, 156634, 156644, 156651, 156653, 156656, 156657, 1566591, 156662, 156901, 156647, 346 11, 346140R, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

046017771

ABSTRACT:
Several fabricating processes for ink jet printheads are disclosed, each printhead being composed of two parts aligned and bonded together. One part is a substantially flat substrate which contains on the surface thereof a lineal array of heating elements and addressing electrodes, and the second part is a substrate having at least one recess anisotropically etched therein to serve as an ink supply manifold when the two parts are bonded together. A lineal array of parallel grooves are formed in the second part, so that one end of the grooves communicate with the manifold recess an the other ends are open for use as an ink droplet expelling nozzles. Many printheads can be made simultaneously by producing a plurality of sets of heating elements array with their addressing electrodes on a silicon wafer and by placing alignment marks thereon at predetermined locations. A corresponding plurality of sets of channels and associated manifolds are produced in a second silicon wafer and, in one embodiment, alignment openings are etched thereon at predetermined locations. The two wafers are aligned via the alignment openings and alignment marks, then bonded together and diced into many separate printheads. A number of printheads can be fixedly mounted in a pagewidth configuration which confronts a moving recording medium for pagewidth printing or individual printheads may be adapted for carriage type ink jet printing.

REFERENCES:
patent: 4106976 (1978-08-01), Chiou et al.
patent: 4157935 (1979-06-01), Solyst
patent: 4275290 (1981-06-01), Cielo et al.
patent: 4362599 (1982-12-01), Imaizumi et al.
patent: 4438191 (1984-03-01), Cloutier et al.
patent: 4463359 (1984-07-01), Ayata et al.
patent: 4468282 (1984-08-01), Neukermans
IBM Tech. Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, Title, "Two-Sided Groove Etching Method to Produce Silicon Ink Jet Nozzles"; Authors: T. S. Kuan et al.
Article, "Fabrication of Novel Three-Dimensional Microstructures by the Anisotropic Etching of (100) and (110) Silicon", in the IEEE Transactions on Electron Devices, vol. ED-25, No. 10 (Oct. 1978) by Ernest Bassous.

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