Thermal imaging composition and member and methods of...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S270100, C430S271100, C430S275100, C430S302000, C430S348000, C430S910000, C430S964000

Reexamination Certificate

active

07022461

ABSTRACT:
An imaging member, such as a negative-working printing plate or on-press cylinder, has an imaging layer comprised of a thermally sensitive compound and a photothermal conversion material. The thermally sensitive compound comprises a heat-activatable bisulfite adduct and can be a polymer or a small molecule compound. In the imaging member, the thermally sensitive compound reacts to provide increased hydrophobicity in areas exposed to energy that provides or generates heat. The imaging layer is considered “switchable” and can be used to provide a lithographic printing image without traditional alkaline wet processing.

REFERENCES:
patent: 4427758 (1984-01-01), Quinn
patent: 5985514 (1999-11-01), Zheng et al.
patent: 6413694 (2002-07-01), Zheng et al.
patent: 6451500 (2002-09-01), Leon
patent: 6537730 (2003-03-01), Fleminig et al.
patent: 6599674 (2003-07-01), Kawamura
patent: 0 652 483 (1998-05-01), None
patent: 02/00442 (2002-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal imaging composition and member and methods of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal imaging composition and member and methods of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal imaging composition and member and methods of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3535443

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.