Thermal heat spreaders designed for lower cost...

Details Thermal heat spreaders designed for lower cost... Thermal heat spreaders designed for lower cost...

2007-03-13

2007-03-13

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S706000, C257S712000, C257S713000, C361S708000, C361S710000

Reexamination Certificate

active

10613418

ABSTRACT:
A heat spreader, comprising a metal body with attached standoffs located approximately above the integrated circuit, is described. The standoffs should improve bond layer thickness control between the integrated circuit and the heat spreader, leading to a lower cost and lower mass package, as well as a more reliable device with increased thermal performance.

REFERENCES:
patent: 5175613 (1992-12-01), Barker et al.
patent: 5410451 (1995-04-01), Hawthorne et al.
patent: 5578788 (1996-11-01), Engsbr.ang.ten
patent: 5621615 (1997-04-01), Dawson et al.
patent: 5898571 (1999-04-01), Mertol
patent: 5931222 (1999-08-01), Toy et al.
patent: 5998241 (1999-12-01), Niwa
patent: 6008536 (1999-12-01), Mertol
patent: 6091603 (2000-07-01), Daves et al.
patent: 6118177 (2000-09-01), Lischner et al.
patent: 6218730 (2001-04-01), Toy et al.
patent: 6252776 (2001-06-01), Saito et al.
patent: 6281573 (2001-08-01), Atwood et al.
patent: 2002/0012231 (2002-01-01), Bhatia et al.

Affiliated with

Also associated with

Rating

Thermal heat spreaders designed for lower cost... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal heat spreaders designed for lower cost..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal heat spreaders designed for lower cost... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3775268