Thermal frame section with offset dual skip debridgings

Details Thermal frame section with offset dual skip debridgings Thermal frame section with offset dual skip debridgings

1990-10-22

1991-10-22

Chilcot, Jr., Richard E.

Static structures (e.g., buildings)

Underlying compressible layer or pad

52480, 52730, 49DIG1, E04B 228

Patent

active

050583514

ABSTRACT:
An architectural thermal break section includes an elongate heat-conductive part having spaced elongate first and second side portions and having an elongate bridge portion extending between the side portions, the bridge portion having therethrough elongate first, second and third lengthwise slots, the second slot having at respective ends thereof first and second end portions which are transversely spaced from and overlap in the lengthwise direction respective end portions of the first and third slots. The break section further includes a lengthwise strip of a thermal barrier material which extends between and is fixedly coupled to each of the first and second side portions. A method of making the break section includes the steps of extruding a metal to form the heat-conductive part, thereafter applying the thermal barrier material to the heat-conductive part, and thereafter machining the slots in the bridge portion of the heat-conductive part.

REFERENCES:
patent: 1803390 (1931-05-01), Howard
patent: 3114179 (1963-12-01), Briggs
patent: 3393487 (1968-07-01), Nolan
patent: 3823524 (1974-07-01), Weinstein
patent: 4128934 (1978-12-01), Doring
patent: 4185439 (1980-01-01), Bischlipp et al.
patent: 4514948 (1985-05-01), Meigs et al.
patent: 4856250 (1989-08-01), Gronau et al.

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