Thermal enhance MCM package

Details Thermal enhance MCM package Thermal enhance MCM package

2005-08-30

2005-08-30

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S678000

Reexamination Certificate

active

06936930

ABSTRACT:
A thermal enhance multi-chips module package mainly comprises an assembly substrate, a first assembly package, a second assembly package, a heat dissipation board, and a thermally conductive metal ring. The first assembly package and the second assembly package are disposed on the upper surface and the lower surface of the assembly substrate respectively; and the thermally conductive metal ring is disposed at the periphery of the upper surface of the heat dissipation board and encompasses the second assembly package. The second assembly package has a logic chip therein and generates a lot of heat, and the heat dissipation board can transmit the heat to the outside through the thermally conductive metal ring so as to prevent the excessive heat from transmitting to the motherboard and accumulating in the motherboard. Accordingly, the motherboard can be avoided damaging.

REFERENCES:
patent: 6204562 (2001-03-01), Ho et al.
patent: 6236109 (2001-05-01), Hsuan et al.
patent: 6696321 (2004-02-01), Joshi

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