Thermal delay non-destructive bond integrity inspection

Details Thermal delay non-destructive bond integrity inspection Thermal delay non-destructive bond integrity inspection

1992-02-20

1993-04-13

Cuchlinski, Jr., William A.

Thermal measuring and testing

Leak or flaw detection

With heating or cooling of specimen for test

73588, 374 4, G01N 2500, G01N 2520, G01N 2900

Patent

active

052018415

ABSTRACT:
A non-destructive method for testing quality of at least one bond which physically and electrically couples a package lead to an integrated circuit. A thermal gradient is created across the at least one bond which causes heat transfer thru the at least one bond. Heat transfer is measured which is proportional to area at a bond interface. The measured heat transfer thru the at least one bond is compared with heat transfer data taken under substantially equal conditions of known good bonds thereby determining quality of the at least one bond. The heat transfer is indirectly measured by creating a mechanical vibration at an input area and by measuring the time it takes the mechanical vibration to reach an output area after the mechanical vibration has traveled through the at least one bond.

REFERENCES:
patent: 3592050 (1971-07-01), Nutt et al.
patent: 4007631 (1977-02-01), Saifi et al.
patent: 4287766 (1981-09-01), Ensminger
patent: 4289030 (1981-09-01), Alers et al.
patent: 4513384 (1985-04-01), Rosencwaig
patent: 4521118 (1985-06-01), Rosencwaig
patent: 4522510 (1985-06-01), Rosencwaig et al.
patent: 4641527 (1987-02-01), Hiroi et al.
patent: 4710030 (1987-12-01), Tauc et al.
patent: 4750368 (1988-06-01), Shearer et al.
patent: 4972720 (1990-11-01), Wu
Gilmore, et al., "High-Frequency Ultrasonic Testing of Bonds: Application to Silicon Power Devices, " Materials Evaluation, pp. 65-72 (Jan. 1979).

Affiliated with

Also associated with

Rating

Thermal delay non-destructive bond integrity inspection does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal delay non-destructive bond integrity inspection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal delay non-destructive bond integrity inspection will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1152077