Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1998-08-26
2000-08-29
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257705, 257778, 257787, 257712, 257713, 257718, 257710, H01L 2312
Patent
active
06111314&
ABSTRACT:
The present invention relates generally to a new method for improving the reliability of cooling designs using thermal paste to cool chips in semiconductor modules and structure thereof. More particularly, the invention encompasses a structure and a method that uses surface chemistry modification of the inside of the thermal cooling caps where it contacts thermal paste. The internal surface of the cap is modified by embedding particles that have the same chemical composition as one or more of the solids used in the thermal paste. The particles may be embedded in the cap by casting, grit blasting, or pressing the particles permanently into the surface.
REFERENCES:
patent: 3704166 (1972-11-01), Cuomo et al.
patent: 4634600 (1987-01-01), Shimizu et al.
patent: 4849247 (1989-07-01), Scanlon et al.
patent: 4886681 (1989-12-01), Clabes et al.
patent: 4917953 (1990-04-01), Hioki et al.
patent: 5023695 (1991-06-01), Umezawa et al.
patent: 5045345 (1991-09-01), Singer
patent: 5098609 (1992-03-01), Iruvanti et al.
patent: 5185184 (1993-02-01), Koran et al.
patent: 5396403 (1995-03-01), Patel
patent: 5430611 (1995-07-01), Patel et al.
patent: 5591789 (1997-01-01), Iruvanti et al.
patent: 5604978 (1997-02-01), Sherif et al.
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5757620 (1998-05-01), Edwards et al.
Coico Patrick A.
Edwards David L.
Iruvanti Sushumna
Pompeo Frank L.
Sherif Raed A.
Ahsan Aziz M.
International Business Machines - Corporation
Jr. Carl Whitehead
Warren Matthew
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