Thermal bus bar design for an electronic cartridge

Details Thermal bus bar design for an electronic cartridge Thermal bus bar design for an electronic cartridge

1998-02-06

1999-11-23

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257723, 257678, H01L 2348, H01L 2334, H01L 2310

Patent

active

059905492

ABSTRACT:
One embodiment of the present invention is an electronic assembly which may have a first integrated circuit package mounted to a first side of a substrate and a second integrated circuit package mounted to a second side of the substrate. A thermal plate may be thermally coupled to the first integrated circuit package. A heat sink may be mounted to the thermal plate. A thermal bus may be is thermally coupled to the second integrated circuit package and the thermal plate. The thermal bus bar allows heat to flow from the second integrated circuit package to the thermal plate and heat sink. The electronic assembly of the present invention can thus remove heat from integrated circuit packages located on both sides of a substrate with only one heat sink.

REFERENCES:
patent: 3395318 (1968-07-01), Laermer et al.
patent: 4711804 (1987-12-01), Burgess
patent: 5061990 (1991-10-01), Arakawa et al.
patent: 5297006 (1994-03-01), Mizukoshi
patent: 5545922 (1996-08-01), Golwalkar et al.
patent: 5719436 (1998-02-01), Kuhn
patent: 5724233 (1998-03-01), Honda et al.

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