Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2005-09-13
2005-09-13
Versteeg, Steven (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C062S062000, C072S199000, C072S362000, C072S365200, C148S559000, C148S577000, C148S695000, C148S696000, C148S688000
Reexamination Certificate
active
06942763
ABSTRACT:
An aluminum alloy sputter target having a sputter target face for sputtering the sputter target is disclosed. The sputter target face has a textured-metastable grain structure. The textured-metastable grain structure has a grain orientation ratio of at least 35 percent (200) orientation. The textured-metastable grain structure is stable during sputtering of the sputter target. The textured-metastable grain structure has a grain size of less than 5 μm. The method forms aluminum alloy sputter targets by first cooling an aluminum alloy target blank to a temperature of less than −50° C. Then deforming the cooled aluminum alloy target blank introduces plastic strain into the target blank and reduces the grain size of the grains to form a textured-metastable grain structure. Finally, finishing the aluminum alloy target blank forms a finished sputter target that maintains the textured-metastable grain structure of the finished sputter target.
REFERENCES:
patent: 4083220 (1978-04-01), Kobayashi et al.
patent: 4159217 (1979-06-01), Selines et al.
patent: 5600989 (1997-02-01), Segal et al.
patent: 5766380 (1998-06-01), Lo et al.
patent: 5809393 (1998-09-01), Dunlop et al.
patent: 5993575 (1999-11-01), Lo et al.
patent: 5993621 (1999-11-01), Liu
patent: 6197129 (2001-03-01), Zhu et al.
patent: 2001/0047838 (2001-12-01), Segal et al.
patent: 2001/0054457 (2001-12-01), Segal et al.
patent: 2003/0098102 (2003-05-01), Perry et al.
patent: 2003/0098103 (2003-05-01), Perry et al.
patent: 799905 (1997-10-01), None
patent: 3115562 (1991-05-01), None
patent: 0015863 (2000-03-01), None
Rigney et al., “Deformation Substructures Associated with Very Large Plastics Strains”, Scripts Metallurgica, vol. 27 (1992) pp 975-980.
Valieve et al., “Structure and Mechanical Behavior of Ultrafine-Grained Metals and Alloys Subjected to Intense Plastic Deformation”, Physics of Metals and Metallography, vol. 85, No. 3 (1998).
Kiyotaka et al., “Influence of Channel Angle on the Development of Ultrafine Grains in Equal-Channel Angular Pressing”, vol. 46, No. 5 (1998) pp 1589-1599.
Shin et al., “Grain Refinement of a Commercial 0.15%C Steel by Equal-Channel Angular Pressing”, Scripta Materialia. vol. 41, No. 3 (1999) pp 259-262.
Tsuji et al., “Ultra-Fine Grained Bulk Steel Produced by Accumulative Roll-Bonding (ARB) Process”, Scripta Materialia, vol. 40, No. 7 (1999) pp 795-800.
Sun et al., “Characteristics of Submicron Grained Structure Formed in Aluminum by Equal Channel Angular Extrusion”, Materials Science and Engineering (2000) pp 82-85.
Gilman Paul S.
Perry Andrew C.
Van den Sype Jaak
Praxair S.T. Technology, Inc.
Schwartz Iurie A.
Versteeg Steven
LandOfFree
Textured-metastable aluminum alloy sputter targets and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Textured-metastable aluminum alloy sputter targets and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Textured-metastable aluminum alloy sputter targets and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3424116