Electric lamp and discharge devices: systems – Cathode ray tube circuits – Combined cathode ray tube and circuit element structure
Patent
1984-10-10
1986-08-19
Niebling, John F.
Electric lamp and discharge devices: systems
Cathode ray tube circuits
Combined cathode ray tube and circuit element structure
204192C, 204192D, 204298, 313106, 313107, 427 39, 427 41, H01J 2302, C23C 1500
Patent
active
046071938
ABSTRACT:
A very thin layer of highly textured carbon is applied to a copper surface by a triode sputtering process. A carbon target 10 and a copper substrate 12 are simultaneously exposed to an argon plasma 14 in a vacuum chamber.
The resulting carbon surface is characterized by a dense, random array of needle-like spires or peaks which extend perpendicularly from the copper surface. The coated copper is especially useful for electrode plates in multistage depressed collectors.
REFERENCES:
patent: 3540989 (1970-11-01), Webb
patent: 3549930 (1970-12-01), Katz
patent: 3702951 (1972-11-01), Kosmahl
patent: 4173522 (1979-11-01), Pulker et al.
patent: 4349424 (1982-09-01), Sovey et al.
patent: 4414085 (1983-11-01), Wickersham et al.
patent: 4417175 (1983-11-01), Curren et al.
patent: 4437962 (1984-03-01), Banks
patent: 4486286 (1984-12-01), Lewin et al.
patent: 4490229 (1984-12-01), Mirtich et al.
patent: 4495044 (1985-01-01), Banks
patent: 4524106 (1985-06-01), Flasck
Marinkovic et al., "Preparation and Properties of Sputtered `Glassy` Carbon Films," Carbon, 1976, vol. 14, No. 6, pp. 329-331.
NASA Technical Paper 1097 "Secondary-Electron-Emission Properties of Conducting Surface with Application of Multistage Depressed Collectors for Microwave Amplifiers" Forman-Nov. 1977.
NASA Technical Paper 2285 "Beam Impingement Angle Effects on Secondary Electron Emission Characteristics of Textured Pyrolytic Graphite" Curren et al-Feb. 1984.
Curren Arthur N.
Jensen Kenneth A.
Roman Robert F.
Chapman Terryence
Manning John R.
Niebling John F.
Shook Gene E.
The United States of America as represented by the Administrator
LandOfFree
Textured carbon surfaces on copper by sputtering does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Textured carbon surfaces on copper by sputtering, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Textured carbon surfaces on copper by sputtering will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-395470