Tetrazole compound-containing photopolymerizable resin compositi

Details Tetrazole compound-containing photopolymerizable resin compositi Tetrazole compound-containing photopolymerizable resin compositi

1986-02-25

1986-12-16

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430954, 430910, 430277, 522 75, 522 95, 522102, 522121, G03C 194, G03C 168

Patent

active

046296794

ABSTRACT:
A photopolymerizable resin composition is described which comprises, (a) 40 to 85 wt. %, based on the composition, of a thermoplastic polymer binder, (b) 15 to 60 wt. %, based on the composition, of a cross-linkable monomer having at least one ethylenically unsaturation, (c) 0.5 to 10 wt. %, based on the total of the binder (a) and the monomer (b), of a photopolymerization initiator, and (d) 0.005 to 1 wt. %, based on the total of the binder (a) and the monomer (b), of a tetrazole compound of the formula: ##STR1## wherein R.sub.1 is H, halogen, methyl, ethyl, phenyl, carboxyl, amino, dimethylamino, diethylamino, methoxy, ethoxy, mercapto or sulfonic acid; and R.sub.2 is H, methyl, ethyl, phenyl, amino or mercapto. The photopolymerization resin composition exhibits an enhanced adhesion to a metal surface, and is useful as a photoresist for fabrication of a printed circuit board.

REFERENCES:
patent: 3622334 (1971-11-01), Hurley
patent: 3645772 (1972-02-01), Jones
patent: 3873316 (1975-03-01), Velten et al.
patent: 4438190 (1984-03-01), Ishimaru et al.

Affiliated with

Also associated with

Rating

Tetrazole compound-containing photopolymerizable resin compositi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Tetrazole compound-containing photopolymerizable resin compositi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Tetrazole compound-containing photopolymerizable resin compositi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-244991