Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2007-03-21
2010-02-02
Nguyen, Ha Tran T (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
07656182
ABSTRACT:
Disclosed are testing method embodiments in which, during post-manufacture testing, parametric measurements are taken from on-chip parametric measurement elements and used to optimize manufacturing in-line parametric control learning and/or to optimize product screening processes. Specifically, these post-manufacture parametric measurements can be used to disposition chips without shipping out non-conforming products, without discarding conforming products, and without requiring high cost functional tests. They can also be used to identify yield sensitivities to parametric variations from design and to provide feedback for manufacturing line improvements based on the yield sensitivities. Additionally, a historical database regarding the key parameters that are monitored at both the fabrication and post-fabrication levels can be used to predict future yield and, thereby, to preemptively improve the manufacturing line and/or also to update supply chain forecasts.
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Bickford Jeanne P.
Goss John R.
Habib Nazmul
McMahon Robert J.
Campbell Shaun
Gibb I.P. Law Firm LLC
International Business Machines - Corporation
Nguyen Ha Tran T
Simmons, Esq. Ryan K.
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