Test tray with carrier modules for a semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

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Details

C257S686000, C206S724000, C206S323000, C206S486000, C206S560000, C206S335000, C206S725000, C206S335000, C361S212000, C361S807000, C361S810000, C361S767000, C439S073000, C324S762010, C174S050510, C073S856000

Reexamination Certificate

active

07135703

ABSTRACT:
A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

REFERENCES:
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4535887 (1985-08-01), Egawa
patent: 4681221 (1987-07-01), Chickanosky et al.
patent: 4881639 (1989-11-01), Matsuoka et al.
patent: 5026303 (1991-06-01), Matsuoka et al.
patent: 5226226 (1993-07-01), Fierkens
patent: 5375320 (1994-12-01), Kinsman et al.
patent: 5675957 (1997-10-01), Kim
patent: 5750421 (1998-05-01), Kasai et al.
patent: 6627483 (2003-09-01), Ondricek et al.
patent: 6644982 (2003-11-01), Ondricek et al.
patent: 59057463 (1984-04-01), None
patent: 09329643 (1997-12-01), None
Japanese Office Action dated Feb. 24, 2006.

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