Test structures for feature fidelity improvement

Details Test structures for feature fidelity improvement Test structures for feature fidelity improvement

2007-08-07

2007-08-07

Whitmore, Stacy A (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Nanotechnology related integrated circuit design

C716S030000, C716S030000

Reexamination Certificate

active

10955748

ABSTRACT:
Systems and techniques for generating test structures. The test structures may conform to a set of design rules for a portion of an integrated circuit design. The test structures may include base figures, which may be in an enriched environment. For example, the test structures may include one or more additional figures such as surrounding figures, external figures, and/or symmetric figures. A correction algorithm for correcting a layout may be checked using a plurality of the test structures.

REFERENCES:
patent: 6063132 (2000-05-01), DeCamp et al.
patent: 6343370 (2002-01-01), Taoka et al.
patent: 6553559 (2003-04-01), Liebmann et al.
patent: 6709793 (2004-03-01), Brankner et al.
patent: 6721938 (2004-04-01), Pierrat et al.
patent: 6920620 (2005-07-01), Hsiao et al.
patent: 2003/0135831 (2003-07-01), Hsiao et al.
patent: 2006/0023932 (2006-02-01), DeMaris et al.
Radojcic, R., et al., “At finer geometries, a new cause for low yields”,EETimes, Apr. 23, 2003, 2 pages.
Schellenberg, F., “Sub-Wavelenght Lithography Using OPC”,Semiconductor Fabtech- 9thEd., pp. 205-209, Mar. 1999.
Taravade, K., et al., “Two dimensional image-based model calibration for OPC applications”,Proc. of the SPIE, vol. 5377, pp. 1522-1527 (2004).

Affiliated with

Also associated with

Rating

Test structures for feature fidelity improvement does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Test structures for feature fidelity improvement, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Test structures for feature fidelity improvement will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3874811