Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2005-07-26
2005-07-26
Thompson, Craig A. (Department: 2813)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S014000, C324S512000, C324S537000
Reexamination Certificate
active
06921672
ABSTRACT:
Disclosed is a semiconductor die having a scanning area. The semiconductor die includes a first plurality of test structures wherein each of the test structures in the first plurality of test structures is located entirely within the scanning area. The semiconductor die further includes a second plurality of test structures wherein each of the test structures in the first plurality of test structures is located only partially within the scanning area. The test structures are arranged so that a scan of the scanning area results in detection of defects outside of the scanning area.
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Adler David L.
Long Robert Thomas
Mantalas Lynda C.
Pinto Gustavo A.
Richardson Neil
Beyer Weaver & Thomas LLP.
KLA-Tencor Technologies Corporation
Pham Thanhha
Thompson Craig A.
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