Test structure design for reliability test

Details Test structure design for reliability test Test structure design for reliability test

2006-10-10

2006-10-10

Hollington, Jermele (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07119571

ABSTRACT:
A flexible semiconductor test structure that may be incorporated into a semiconductor device is provided. The test structure may include a plurality of test pads designed to physically stress conductive lines to which they are attached during thermal cycling. By utilizing test pads with different dimensions (lengths and/or widths), the effects of thermal stress generated by a plurality of conductive lines having corresponding different dimensions may be simulated.

REFERENCES:
patent: 6320391 (2001-11-01), Bui
patent: 6362638 (2002-03-01), Ashton et al.
patent: 6822437 (2004-11-01), Hau-Riege et al.

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