Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1996-01-26
1998-09-15
Bradley, P. Austin
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439912, 324765, H01R 909
Patent
active
058071040
ABSTRACT:
A socket with a main socket body 10 for use in a burn-in test of a bare chip 80 with a large number of contact connectors BP is provided with a positioning plate 42 in the top of the socket body 10. This positioning plate has a plurality of through holes 42c with contact members 48 slidingly contained therein. The through holes 42c and contact members 48 are aligned in one to one relationship to contact connections on the bare chip on one side of positioning plate 42 and a plurality of electroconductive film contacts 50 on the other side of the positioning plate 42. The film contacts are movably supported in the socket. Additionally, the film contacts 50 are electrically connected in a one-to-one relationship to socket contact 56 contained in the socket for providing electrical connection between bare chip 80 and socket 10.
REFERENCES:
patent: 5277594 (1994-01-01), Matsuoka et al.
patent: 5395255 (1995-03-01), Kato
patent: 5407361 (1995-04-01), Ikeya
patent: 5460538 (1995-10-01), Ikeya
patent: 5481436 (1996-01-01), Werther
Ikeya Kiyokazu
Padovani Francois A.
Baumann Russell E.
Bradley P. Austin
Donaldson Richard L.
Grossman Rene E.
Standig Barry M-L.
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