Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Patent
1999-10-14
2000-06-27
Bowers, Charles
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
438 18, 257 48, H01L 2166
Patent
active
060805978
ABSTRACT:
A test pattern structure and a misalignment measuring method for measuring a misalignment between multiple patterns happening during a semiconductor device fabrication process are disclosed. The test pattern structure includes a semiconductor substrate, a plurality of first conductive layer patterns, a plurality of second conductive layer patterns, a plurality of resistors, first and second pads, and a plurality of electrical connections. The first conductive layer patterns are formed spaced-apart on the semiconductor substrate in a predetermined direction, the second conductive layer patterns are formed spaced-apart on the semiconductor substrate, and the resistors are formed on the semiconductor substrate electrically connected to a respective one of the second conductive layer patterns. Each one of the second conductive layer patterns are paired with a respective one of the first conductive layer patterns such that each pair of first and second conductive layer patterns define a horizontal separation distance wherein the horizontal separation distances of the respective pairs of first and second conductive layer patterns increase along the predetermined direction. The first pad is connected to a first one of the first conductive layer patterns, the electrical connections connects the second conductive layer patterns to a respective next one of the first conductive layer patterns, and the second pad commonly connected with the resistors.
REFERENCES:
patent: 4347479 (1982-08-01), Cullet
patent: 5770995 (1998-06-01), Kamiya
Ulrich Kaempf, The Wheatstone Bridge as an Alignment Test Structure, Proc. IEEE 1995 Int. Conference on Microelectronic Test Structures, vol. 8, Mar. 1995, pp. 27-30.
Bowers Charles
LG Semicon Co. Ltd.
Thompson Craig
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