Test pad design for reducing the effect of contact resistances

Details Test pad design for reducing the effect of contact resistances Test pad design for reducing the effect of contact resistances

2008-08-22

2010-11-02

Tang, Minh N (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S765010

Reexamination Certificate

active

07825678

ABSTRACT:
An integrated circuit structure includes a semiconductor wafer; integrated circuit devices in the semiconductor wafer; and a plurality of test pads on a top surface of the semiconductor wafer and connected to the integrated circuit devices. Test pads are grouped in pairs, with the test pads in a same pair are interconnected.

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