Test apparatus for a semiconductor package

Details Test apparatus for a semiconductor package Test apparatus for a semiconductor package

2007-05-22

2007-05-22

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

C257S698000, C257S724000, C257SE23179, C439S071000

Reexamination Certificate

active

10921188

ABSTRACT:
A test apparatus for a semiconductor package which has at least one chip and a plurality of solder balls includes a socket body, a circuit substrate, and a socket lid. The socket body has a plurality of traces electrically connected to an exterior electric test apparatus. The circuit substrate is disposed in the socket body for supporting the semiconductor package and has a plurality of metal extension traces for connecting the solder balls of the semiconductor to the traces of the socket body. The socket lid has a platform body and a soft pad, wherein the platform body presses the semiconductor package and the soft pad is disposed between the platform body and the semiconductor package.

REFERENCES:
patent: 5808877 (1998-09-01), Jeong et al.
patent: 6062873 (2000-05-01), Kato
patent: 6083013 (2000-07-01), Yamagishi
patent: 6152744 (2000-11-01), Maeda

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