Test and tear-away bond pad design

Details Test and tear-away bond pad design Test and tear-away bond pad design

1997-10-07

1999-04-06

Graybill, David

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

438106, 438612, H01L 21603

Patent

active

058917454

ABSTRACT:
A process of providing a bond pad arrangement for use with a thermocompression wire bonder including a primary bond pad for connection of an integrated circuit during a production assembly process, and a secondary test bond pad contiguous with the primary bond pad for connection of a wire to the integrated circuit. Including performing a test sequence, and removing the wire from the secondary test bond pad.

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