Metal fusion bonding – Process – Plural joints
Patent
1997-03-26
1999-09-14
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228254, H05K 334
Patent
active
059509074
ABSTRACT:
An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.
REFERENCES:
patent: 5060844 (1991-10-01), Behun et al.
patent: 5520752 (1996-05-01), Lucey, Jr. et al.
patent: 5525548 (1996-06-01), Nishiguchi
Metals Handbook Ninth Edition, vol. 6, pp. 1091-1096, 1983.
Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York, Editor by: Rao R. Tummala and Eugene J. Tymaszewski; 1989, cover pages and pp. 361-391, 1989.
SLT Device Metallurgy and Its Monolithic Extension, IBM J. Res. Develop., by P.A. Tota nad R.P. Sopher, vol. 3, May 1969, pp. 226-238, 1969.
Ashan Aziz M.
Heinrich Samuel M.
International Business Machines - Corporation
Tomaszewski John J.
LandOfFree
Ternary solder for the enhancement of C-4 fatigue life does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ternary solder for the enhancement of C-4 fatigue life, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ternary solder for the enhancement of C-4 fatigue life will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1500609