Ternary solder for the enhancement of C-4 fatigue life

Details Ternary solder for the enhancement of C-4 fatigue life Ternary solder for the enhancement of C-4 fatigue life

1996-07-25

1998-11-03

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257779, 257778, 420566, 420570, H01L 2348

Patent

active

058313362

ABSTRACT:
An enhanced fatigue life solder comprising, by weight, about 1-3% tin, about 1-3% silver and the balance essentially lead is provided. The solder is particularly useful for joining electronic components and in particular for making C-4 interconnections. A method for using the solder to make electronic components and electric components made using the method are also provided.

REFERENCES:
patent: 5060844 (1991-10-01), Behun et al.
patent: 5520752 (1996-05-01), Lucey, Jr. et al.
patent: 5525548 (1996-06-01), Nishiguchi
SLT Device Metallurgy and Its Monolithic Extension, IBM J. Res. Develop. by P.A. Totta and R.P. Sopher, vol. 3, May 1969, pp. 226-238.
Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York Edited by: Rao R. Tummala and Eugene J. Rymaszewski; 1989, Cover page and pp. 361-391.

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