Temporary semiconductor package having hard-metal, dense-array b

Details Temporary semiconductor package having hard-metal, dense-array b Temporary semiconductor package having hard-metal, dense-array b

1996-10-03

1998-07-21

Chaudhuri, Olik

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

438 15, 438117, 438125, 257 48, 257727, 257738, H01L 2334, H01L 2166, G01R 3126

Patent

active

057834610

ABSTRACT:
A temporary package for testing semiconductor dice, a method for forming the temporary package and a method for testing dice using the temporary package are provided. The temporary package includes hard-metal ball contacts arranged in a dense grid pattern, such as a ball grid array. The dense grid pattern allows the temporary package to include a large number of ball contacts (e.g., 50 to 1000 or more) to permit testing of dice having a large number of bond pads, or dice that require a large number of input/output signals. The ball contacts can be formed of a metal such as nickel, copper or beryllium copper and are adapted to resist wear, deformation and breakage during continued use of the package. For forming the package, a package base can be formed with land pads and the ball contacts can be attached to the land pads by soldering, brazing, welding, or with a conductive adhesive.

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