Temporary package for bare die test and burn-in

Details Temporary package for bare die test and burn-in Temporary package for bare die test and burn-in

1994-07-27

1995-09-19

Hajec, Donald

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

439331, 257704, 257727, H01R 909, H05K 100

Patent

active

054511658

ABSTRACT:
A temporary package used to test and burn-in a bare die that will fit in a board mounted socket. The package comprises a base having contacts to engage the die and provide contact to the outer periphery, a lid for pressing the die into electrical contact and a protective cover to restrict the die from damage due to external pressures to the sides or top of the package. The die, lid and protective cover can be assembled onto the base and removed by automated equipment.

REFERENCES:
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patent: 4881639 (1989-11-01), Matsuoka et al.
patent: 4918513 (1990-04-01), Kurose et al.
patent: 4924353 (1990-05-01), Patraw
patent: 4969828 (1990-11-01), Bright et al.
patent: 5088190 (1992-02-01), Malhi et al.
patent: 5123850 (1992-06-01), Elder et al.
patent: 5127837 (1992-07-01), Shah et al.
patent: 5171290 (1992-12-01), Olla et al.
patent: 5302891 (1994-04-01), Wood et al.
patent: 5318451 (1994-06-01), DelPrete et al.
patent: 5322446 (1994-06-01), Cearley-Cabbiness

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