Temperature-controlled support for semiconductor wafer

Details Temperature-controlled support for semiconductor wafer Temperature-controlled support for semiconductor wafer

1982-03-31

1984-02-21

Hayes, Monroe H.

Photocopying

Projection printing and copying cameras

With temperature or foreign particle control

G03B 2752

Patent

active

044326351

ABSTRACT:
A support for a semiconductor wafer about to be subjected to exposure through a photomask, e.g. a rotatable chuck, comprises a stage to which the wafer is temporarily adhered by suction and whose temperature is controlled by an array of Peltier elements responsive to a thermoelectric sensor disposed close to the wafer-carrying stage surface. The Peltier elements are horizontally arrayed in a rectangular block inserted between the stage and an underlying base of the support, the block being cemented into a metal frame which has only limited contact with the stage and the base to minimize heat conduction therebetween. The base has channels for the circulation of a temperature-modifying fluid such as water.

REFERENCES:
patent: 4202623 (1980-05-01), Watkin

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