Electric heating – Heating devices – With heating unit structure
Patent
1992-12-09
1996-07-23
Jeffery, John A.
Electric heating
Heating devices
With heating unit structure
219543, 338312, 338314, 338292, 174262, 361795, H05B 302
Patent
active
055391869
ABSTRACT:
A multi-layer module that has incorporated therein an additional sheet with a heat generating film resistor formed thereon. A temperature responsive controller regulates the film resistor current in order to regulate the temperature at the surface of the module. The invention is applicable to both single chip and multiple chip modules, and for multi-chip modules a plurality of discrete film resistors on a single may be used.
REFERENCES:
patent: 2876393 (1959-03-01), Tally et al.
patent: 3440407 (1969-04-01), Goltsos et al.
patent: 3475588 (1969-10-01), McMaster
patent: 3584189 (1971-06-01), Marcoux et al.
patent: 3684858 (1972-08-01), Buck
patent: 3710195 (1973-01-01), Sada et al.
patent: 3775725 (1973-11-01), Endo
patent: 4298770 (1981-11-01), Nishihara et al.
patent: 4374316 (1983-02-01), Inamori et al.
patent: 4434321 (1984-02-01), Betts
patent: 4481403 (1984-11-01), DelMonte
patent: 4506139 (1985-03-01), Daughton
patent: 4582975 (1986-04-01), Daughton
patent: 4644141 (1987-02-01), Hagen et al.
patent: 4652974 (1987-03-01), Ryan
patent: 4663497 (1987-05-01), Reimann
patent: 4706165 (1987-11-01), Takenaka et al.
patent: 4733056 (1988-03-01), Kojima et al.
patent: 4769525 (1988-09-01), Leatham
patent: 4788404 (1988-11-01), Kent
patent: 4870746 (1989-10-01), Klaser
patent: 4901051 (1990-02-01), Murata et al.
patent: 4931354 (1990-06-01), Wakino et al.
patent: 5010233 (1991-04-01), Henschen et al.
patent: 5155340 (1992-10-01), Morita et al.
patent: 5164699 (1992-11-01), Smith et al.
patent: 5218761 (1993-06-01), Maniwa et al.
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5243144 (1993-09-01), Ogino et al.
patent: 5468936 (1995-11-01), Deevi et al.
Abrami Anthony J.
Arienzo Maurizio
DiGiacomo Giulio
Gaudenzi Gene J.
McLaughlin Paul V.
Ahsan Aziz M.
International Business Machines - Corporation
Jeffery John A.
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