Temperature controlled hybrid assembly

Details Temperature controlled hybrid assembly Temperature controlled hybrid assembly

1990-06-15

1993-02-16

Zazworsky, John

Electrical transmission or interconnection systems

Personnel safety or limit control features

Interlock

307303, 257467, H01L 2700

Patent

active

RE0341797

ABSTRACT:
A hybrid circuit structure includes an electrical circuit and a heating circuit therefor, both mounted on a single substrate. Valuable substrate space is saved by mounting the electrical circuit components on one surface of the substrate and the heating circuit elements on the opposite surface. A temperature control circuit is included, preferably mounted on the same surface as the electrical circuit components. Precision resistors for gain control and other functions may be provided on a separate substrate which may be mounted directly to the single substrate or to a separator therebetween. The precision resistors are in thermal contact with the temperature controlled heating circuit, thereby further increasing the stability of the circuit.

REFERENCES:
patent: 3444399 (1969-05-01), Jones
patent: 3571517 (1971-05-01), Merryman
patent: 3703651 (1972-11-01), Blowers
patent: 3781515 (1973-12-01), Morris, Jr. et al.
patent: 4146903 (1979-03-01), Dobkin

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