Apparatus for electroplating the main surface of a substrate

Details Apparatus for electroplating the main surface of a substrate Apparatus for electroplating the main surface of a substrate

1994-12-23

1995-08-22

Niebling, John

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204245, 204275, 204284, C25D 1700, C25D 1712

Patent

active

054437075

ABSTRACT:
An apparatus for electroplating a semiconductor substrate with a metallic film having a uniform thickness. Such a metallic film with a uniform thickness is formed by adjusting the arrangement of the anode so that the intensity distribution of the electric field generating on the main surface to be plated is made substantially uniform. The diameter of the anode is equal to or smaller than one-half that of the main surface of the semiconductor substrate so that the intensity distribution of the electric field on the main surface is substantially uniform. Further, the anode is formed into a mesh which amounts to an area factor equal to or smaller than 50%, which permits the fluctuation of the flux distribution of the plating solution to be neglected.

Affiliated with

Also associated with

Rating

Apparatus for electroplating the main surface of a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for electroplating the main surface of a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for electroplating the main surface of a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2139439